The vq100 package has the easiest layout and uses very common, lowcost pcb dimensions, as shown in table 6. Air cavity qfn packages openmolded plastic packages ompp quikpaks exclusive openmolded plastic package ompp is a premolded, air cavity qfn package quad flat nolead designed to provide a high quality, fast solution for your ic packaging and ic assembly needs. Examples of large size qfn and son package types nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. If pin pitch and body width are the same youre on the right track but this is never a guarantee. The qfn dimensions used in the land pattern design. Each cad and any associated text, image or data is in no way sponsored by or affiliated with any company, organization or realworld item, product, or good it may purport to portray. Design guidelines for cypress quad flat nolead qfn. When the qfn package design needs to start the assembly house will ask you for a few documents. Pcb land pattern guidelines the qfndfn is a surface mountable package with bottom termination of its external connections pins.
Quikpak, originally founded in 1994 as spt, was purchased by delphon industries in 2000. They will help you prepare your classes for use in packages. Pcb design perfection starts in the cad library part 15 qfn. If a qfn package with an lti feature is used, a solder joint fillet at the side wall of the qfn land is enabled, because an lti feature provides a partly plated and therefore wettable side wall at. In principles of package design matthias noback tells you everything about designing software components, also known as packages. Examples of small size qfn and son package types figure 2. Tn1257 pcb layout recommendations for qfn packages. In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch package classifications 14 3 special packages package symbol type package types old new pin count cob chip on board ks ka custom design tcp tape carrier package avz va custom design memory module socket type ys bs ds ya yb yc yd ye special packages cot chip on tape d r a c c i c k. And8086d board mounting notes for quad flatpack no. While dr qfn packages share common characteristics with conventional qfns in terms of design, performance and reliability12 3, surface mounting stands out as a major challenge in the package. Qfnquad flat noleaddfn dual flat nolead is a near cspchip size packageplastic encapsulated package using conventional copper leadframe technology. Applications requiring low standoff heights, improved thermal performance, reduced size or reduced weight are good candidates for qfn designin. Cypress qfnpackaged devices offer a near chipsized footprint with a high io count compared with standard leaded ic packages, such as small.
The data showed that dual row qfn resulted in more voiding than the single row qfn component. The computeraided design cad files and all associated content posted to this website are created, uploaded, managed and owned by third party users. Experimentation with qfn packages of similar size has shown that these packages. Flat noleads, also known as micro leadframe mlf and son smalloutline no leads, is a surfacemount technology, one of several package technologies that connect ics to the surfaces of pcbs without throughholes. Qfn packages avoid routing between the flag and the pads of a qfn device, as shown in figure 4 below.
Cell phones, pdas, portable music and video players can significantly benefit from this package. The land pattern design for all qfn type packages is based on the ipc7093 and ipc7351 standards. Nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. Pcb design and rework, package performance information such as mo isture sensitivity level msl rating, board level reliability, mechanical, and thermal resistance data are also included for reference. Premolded cavity qfn package from global chip materials. In my experience qfn and tqfn are pretty similar for example that program doesnt list tqfn, only qfn. Make sure all files are saved in the cmyk color mode and 300dpi resolution. Qfn package dimensions and tolerances, refer to the packaging specification ds00000049. Intersils quad flat no lead qfn package family offering is a relatively. Design guidelines for cypress quad flat nolead qfn packaged devices. Assembly guidelines for qfn quad flat nolead and son. The qfn package is a thermally enhanced standard size ic package designed to eliminate the use of bulky heat sinks and slugs. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as well as major military and aerospace institutions.
This is because of its low cost, compared to other package types. To view the new drawing, go to and search on the new 98a package number for your device. Simulation results and model validated against measured data to 40. Electrical connection recommendations for the exposed pad on qfn and dfn packages. The book is really split into three major portions although there are six chapters. Some key qfn design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken. The layout recommendations for the cc256x qfn device described in this document are based on two routable layers and two solid ground layers layer 2 and layer 4.
Similar qfn type, but different package design, would result in different voiding level, as shown in the case of qfn2 and qfn156 figure 16. A significant effect on mounting the qfn package on the board and the quality of. In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch jan 01, 2008 theres a lot that goes behind package design. Lgaqfn solderability can be a challenge, and with an increasing number of components produced in this format, care needs to be taken to find a suitable test method. Design guidelines for cypress quad flat nolead qfn packaged. Board level reliability and assembly process of advanced qfn.
The quad flat pack no leads qfn style of leadless packaging is becoming ever more used for many applications in printed circuit board assembly. Qfn 5532050x 5 mm package model description the pkgbaiqfn5532001 is a simulation based equivalent circuit model of barry industries pn qfn 5532050x molded 5 mm quad flat no lead qfn surface mount package. This book is a quick reference and primer on package design and the principles that make design projects successful. The quad flat nolead qfn package is a csp plastic encapsulated package with a copper lead frame substrate. Drmos soldering guidelines recommendations for printed. Refer to published reports, books, papers 410 for this category of. Ipc7526 stencil and misprinted board cleaning hand book. What size land pad should i design on my board for these packages. Reproduction of information in ti data books or data sheets is permissible only. Qfn quadflat noleads is a plastic smt package consisting of. Jan 21, 20 qfn package is probably the most successful package type today. Land pad and exposed pad design is the key to boardlevel reliability, and texas instruments strongly recommends following the design rules included in the application note. Body of knowledge bok for leadless quad flat noleadbottom.
And8086d board mounting notes for quad flatpack nolead. This style of package was selected for investigation. Qfn is a lead framebased package which is also called csp chip scale package with the ability to view and contact leads after assembly. Ansys hfss 3d simulation data was used to create model. The bond diagram shows an example for a 16 pin qfn. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as. Qfn package style is relatively new, such industry guidelines for it. Board layout and stencil information for most texas instruments ti quad flat. The dualrow or multirow qfn package utilizes an interstitial lead design that. Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn. Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn physically and electrically connect integrated circuits to printed circuit boards. The qfn is a leadless package where electrical contact to the pcb is made by soldering the leads on the bottom surface of the package to the pcb, instead of.
Open cavity qfn package global chip materials manufactures premolded open cavity qfn packages in standard jedec body sizes and lead counts. While drqfn packages share common characteristics with conventional qfns in terms of design, performance and reliability12 3, surface mounting stands out as a major challenge in the package. Here in komex we found a way to inspect qfns since we dont have any xray machine in line to verify the well soldering. Trials were also conducted for qfns processed onto flexible circuits using similar design rules and process parameters as for the rigid boards.
Reproduction of ti information in ti data books or data sheets is permissible only if. The qfn can have a single or a multiple rows of pins. Two types of rigid laminate construction were used. Circuits assembly online magazine lgaqfn solderability. Because the qfn platform represents the latest in surface mount packaging technology, it is important that the design of the printed circuit board pcb, as well as the assembly process, follows the suggested guidelines outlined in this document. Routing and vias between the flag and the pads can easily be shorted to either the flag or to the pads because of the physical dynamics of the solder under the device. Cadence ic package design technology ic packaging is now a critical link in the siliconpackageboard design flow. The first portion talks about the history, art and science of package design. The mapmolded, sawn type is the standard for nxps packages.
Two different package configurations were used, so as to have different types of side terminations. Package design workbook explains all the ins and outs of packaging design in depth. Qfn package could be used in a variety of applications. This document describes the printed wiring board design and the pcba guidelines. Package dimensions dfn10, qfn24, qfn28, cqfn32, qfn48 release b2, page 33 mm min. The second part covers the important, yet lesser known package design principles.
The cadence allegro environment offers complete and scalable technology for the design and implementation of pcbs, packages, and systemsinpackage sips. The 6mil line and spacing design rules for leadframe mlfqfn dictates a wide pitch of 12 mils. This package can be easily mounted using standard pcb assembly techniques and can be removed and replaced using standard repair procedures. Packaging essentials outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. An2265 assembly guidelines for land grid array lga. This book breaks down the process of design in a much more comprehensive way than most books on the subject, which. For more information about qfn package use, see eb806. The quad flat nolead qfn package has been used widely since its introduction in 1998.
Bottom terminated components and quad flat nolead btcqfn packages have been. The package structure conducts a costeffective packaging solution that benefits to minimize package size as well as enhances thermal and electrical performance over the traditional leaded. The quad flat nolead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. The free e book for packaging and graphic designers containing a collection of editable retail packaging dielines that are ready to download, design, and share. High temperature cofired ceramic htcc package design and. Offering low price, excellent performance and small size, it is an ideal package for many applications. Qfn quad flat noleaddfn dual flat nolead is a near cspchip size package plastic encapsulated package using conventional copper leadframe technology. In the first part youll revisit the solid principles of class design. Pcb land pattern design and surface mount guidelines for. The major features a of the final package design are listed in table 1. Qfn package design played a critical role in voiding formation of the solder joint. Qfn package is probably the most successful package type today. Section view of a qfn package sloa122 july 2006 qfn layout guidelines 1 submit documentation. Package design workbook addresses all aspects of the creative process including choosing a package format, colors and materials, final finishes, and special considerations such as awkward objects and unique display considerations.
Even if the device ds doesnt give you land patterns, you should be able to tell by comparing the pad sizes between two similar parts. Once your client has approved the final design, send them all of the design files. Ic packaging design and modeling ic packaging complexity levels are rising yearbyyear in lock step with process advances and electrical performance enhancements. Designing product packaging logos, web, graphic design.
303 465 1667 465 1223 114 1028 642 842 1256 814 1312 1369 406 690 734 994 942 268 9 893 771 374 1220 95 1304 1398 686 808 819 1395 1488